Advanced RF MEMS
RF Cafe Quiz #36

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RF Cafe Featured Book - Advanced RF MEMS, by Stepan LucyszynThis quiz is based on the information presented in Advanced RF MEMS, by Stepan Lucyszyn. This book is full of cool micrographs of actual device geometries. Cambridge University Press is the publisher. Note: Some of these books are available as prizes in the monthly RF Cafe Giveaway.

1.  What does the acronym MEMS stand for?

a)  Micro Electro Mechanical deviceS
b)  Microelectromechanical Systems
c)  Micro Electronic & Mechanical deviceS
d)  Miniature Electromechanical system

2.  Which material is commonly used in RF MEMS for its superior magnetic and thermal
     expansion properties?

a)  Cotton
b)  Tin oxide
c)  Electroplated nickel
d)  Homogenized Strontium

3.  What distinguishes MEMS devices from traditional integrated circuits?

a)  Significantly higher gain for amplifiers
b)  Radiation hardening for space environments
c)  Less expensive to produce
d)  Physical displacement of internal components

4.  Which properties of a MEMS RF switch are
     superior to a solid state RF switch?

a)  Insertion loss and bandwidth
b)  Speed and size
c)  Device packaging
d)  Interconnects

5.  Which properties of a MEMS RF switch are
     inferior to a solid state RF switch?

a)  Insertion loss and bandwidth
b)  Speed and size
c)  Device packaging
d)  Interconnects

6.  What is the purpose of a sacrificial layer during MEMS fabrication?

a)  Faster processing
b)  Cheaper to produce
c)  It appeases the MEMS gods
d)  Allows dry etching to reduce undercutting and erosion common with wet etching

7.  Which application would be perfect for multi-pole, multi-throw MEMS RF switch?

a)  Test matrix measurement setups
b)  Multi-band smartphones
c)  Steerable antenna arrays
d)  All the above

8.  What is the purpose of a "hold electrode?"

a)  To counter induced bias from a strong RF signal power level
b)  To keep the connection from letting go
c)  To prevent arcing
d)  Named after inventor Emmanuel Hold

9.  Which phenomenon is possible in a MEMS device but not in a solid state device?

a)  Shock-induced actuation
b)  Activation due to cosmic rays
c)  Overcurrent fusing
d)  Oscillation

10.  What is zero-level (0-level) packaging?

a)  No encapsulation required
b)  The highest level of clean room for encapsulation
c)  On-wafer encapsulation
d)  Metallic packaging


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