EDI CON USA Announces 2017 Event: Save the Date! |
|
November 30, 2016 (Norwood, Mass.) – EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Massachusetts. Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity, and EMI/EMC products. The exhibit hall will also feature the popular Frequency Matters Theater, which offers speed training, presentations, and lectures for all pass holders during the two exhibition days. This year, EDI CON USA will feature a 3-day conference, with extended tutorials and short courses on Monday, September 11, followed by technical papers, workshops, and panels on Tuesday and Wednesday. The conference focuses on actionable, educational sessions rather than product pitches and commercial presentations. According to one conference attendee from EDI CON USA 2016, "It is wonderful to have so many specialists in one place. You can get your problems solved. This is a great conference." The technical sessions will be organized around tracks focused on RF, microwave, and high-speed digital design (including signal integrity, power integrity, and EMC/EMI), modeling and measurement topics. This year, EDI CON USA is the only RF/microwave industry conference and exhibition in the continental USA, and the largest high-speed technical conference on the US East Coast. Event organizers plan to add local private busing for Boston area residents as well as partner programs and group/alumni discounts. Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome reception and a happy hour. So, save the date, and make plans to attend and participate in the second annual EDI CON USA. EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and the Signal Integrity Journal. More information, including how to exhibit for EDI CON USA 2017, is available at http://www.ediconusa.com. The Call for Abstracts will open in January 2017. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-19, 2018. About EDI CON USA EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. About the Organizers EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas. The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification. Event Contacts: Janine Love, Event Director Sales Contact: Carl Sheffres, Publisher Editorial Contacts: North America: International:
Posted December 19, 2016 |
